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TSMC, ASE Group, Amkor, and UMC Accelerate CoWoS Capacity Expansion
2 week ago /
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Author：小编
Semiconductor equipment manufacturers revealed that TSMC, ASE Group, Amkor, and UMC are accelerating the expansion of their advanced packaging CoWoS capacity. From the perspective of order distribution, customer demand for GPU and ASIC chips from 2026 to 2027 exceeds expectations. Among them, NVIDIA has reserved more than half of TSMC's CoWoS capacity, with Broadcom and AMD ranking second and third, respectively.
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