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TSMC's Cutting-Edge Packaging Solutions Witness a Flood of Orders, Driving Rapid Expansion and Outsourcing, and Fueling Growth in Equipment Chains like Synopsys and Wanrun
1 week ago /
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Author：小编
Owing to a significant uptick in orders for AI and high-performance computing from prominent clients, including NVIDIA, Google, Amazon, and MediaTek, TSMC's entire range of CoWoS advanced packaging capabilities is now operating at full throttle. Processes such as CoWoS-L and CoWoS-S are experiencing intense pressure, with operational temperatures soaring. Morgan Stanley projects that by 2026, TSMC's CoWoS capacity will soar to 125,000 wafers per month, marking a substantial 79% surge from the levels anticipated at the end of 2025. The bulk of this new capacity will be earmarked for NVIDIA and Broadcom, with MediaTek also securing a share of the available quota.
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