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CoWoP Ushers in a New Era: ASE Holding Poised to Clinch the Deal
2025-12-08 /
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Author：小编
TSMC is currently collaborating with its partners to tackle the problem of inadequate CoWoS capacity. In the meantime, reports have surfaced indicating that NVIDIA is in the process of developing a cutting - edge packaging technology dubbed 'CoWoP' (Chip on Wafer on PCB). NVIDIA has placed its trust in SPIL, a subsidiary of ASE Holding, to manage this project. SPIL will work in tandem with several top - tier PCB manufacturers. This news has not only captured widespread attention but has also significantly enhanced ASE Holding's standing in the market.
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