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The construction of TSMC's manufacturing facility in Arizona, United States, is progressing at a faster pace than initially anticipated. This has spurred the company's management to expedite their strategy of incorporating more cutting-edge manufacturing techniques on-site. Yet, this advancement has also brought to light the shortcomings in the park's capabilities for advanced packaging. At present, the park has successfully commenced high-volume production of processes like the 4nm technology and is fabricating 'Made in USA' Blackwell chip wafers for NVIDIA. Despite this, these wafers are still required to be transported back to Taiwan to undergo advanced packaging procedures, such as CoWoS. Industry experts contend that this approach poses considerable challenges concerning supply chain efficiency and the mitigation of geopolitical risks.
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