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The research report indicates that the market for AI PCB electroplating copper powder consumables is set to enter a boom cycle. This development is poised to propel significant growth in the processing fee profits within the copper powder industry. Copper spheres and copper powder, serving as the primary consumables for PCB electroplating, constitute 6% and 13% of the costs, respectively. As AI PCBs become thicker, feature more layers, and incorporate an increasing number of blind and buried vias, the utilization rate of copper powder is anticipated to climb. By 2029, it is projected that the share of PCB copper powder consumables in electroplating consumables will surge from 15% to over 27%. Furthermore, the processing fee for copper powder is 4 to 5 times higher than that of copper spheres.
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