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MW Laser: The company's high-selectivity etching equipment and hybrid bonding equipment can be used in DRAM processes
2025-12-02 /
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Author：小编
On December 1st, MW Laser (300751.SZ) disclosed on an interactive platform that its high-selectivity etching equipment and hybrid bonding equipment can be applied in DRAM (High Bandwidth Memory HBM) processes. Meanwhile, the company's etching and thin-film deposition equipment have been widely used in the manufacturing of memory chips and logic chips.
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