According to reports, Professor Wu Dezhi's research team from the Institute of Micronano Science and Technology at Xiamen University's Saben-Dong Micro-Nano Science and Technology Research Institute has made a remarkable breakthrough in 3D printing technology. They have introduced an innovative 'laser in-situ induced direct writing printing' technique, significantly cutting down the curing time for three-dimensional flexible devices made from thermoset materials. Traditional methods required tens of hours for curing, whereas this new technology accomplishes the task in a mere 0.25 seconds. This development effectively overcomes challenges like sluggish molding speeds, intricate processes, and the difficulties associated with precisely controlling performance.

The technology harnesses the local photothermal effect generated by laser in-situ irradiation of microscale jets. This rapidly elevates the material temperature to a range of 150-300℃, triggering instant cross-linking and curing of the thermoset ink. Moreover, this method allows for the printing of complex three-dimensional structures without the necessity of supporting materials. It achieves a structural resolution of 50 micrometers and an aspect ratio of up to 50. The technology also permits real-time adjustments of process parameters, enabling continuous and programmable regulation of mechanical and electrical properties within a 10 to 20-fold range.

Currently, the team has leveraged this technology to manufacture products such as stretchable electronic devices with stiffness gradients, highly sensitive flexible pressure sensors, and high-performance three-dimensional magnetically driven soft robots. These products have broad applications in scenarios like smart wearables, human motion monitoring, and precision actuation. This technology exhibits excellent compatibility and scalability with various thermoset materials, demonstrating strong potential for industrialization. The related research findings have been published in the prestigious international journal Nature Electronics.