Recently, during an interview with a reporter, it was disclosed that the high-end base materials in the upstream sector of the PCB industry chain are witnessing shortages and price surges to varying extents, all propelled by the burgeoning demand for AI. Ding Yu, the Dean of the Nord Research Institute, highlighted that there is a constrained supply of high-end electronic copper foil. Presently, the company has commenced shipping its RTF-3 products, while RTF-4 and HVLP-3 are undergoing validation with downstream customers.

A relevant person in charge from Honghe Technology remarked that the price of the company's high-performance product, "Low Dielectric Generation I," is sixfold that of ordinary products. Owing to their scarcity in the market, prices for Low Dielectric Generation II and products with a low thermal expansion coefficient are continuing to climb. As for high-grade copper clad laminates, an individual from an A-share manufacturer noted that the base materials for application scenarios such as AI and robotics are trending towards thinner and lighter designs, especially with a growing demand for high-performance products in the computing power sector. Given that these products are not universally applicable, production equipment and processes must be gradually adjusted in response to market demand, which has consequently led to a constrained current production capacity.