On November 28, reports emerged indicating that TSMC is in the process of constructing two advanced packaging plants utilizing CoWoS (Chip-on-Wafer-on-Substrate) technology in Chiayi. Earlier, the construction site witnessed several safety incidents, which resulted in temporary work halts in certain sections. However, these incidents had only a marginal impact on the overall construction timeline. The local government has confirmed that installation and testing procedures have already kicked off at the second plant, with mass production slated to begin next year. Meanwhile, the first plant is projected to initiate installation work next year and commence mass production in the subsequent year. The establishment of these two plants is expected to generate roughly 3,000 employment opportunities within the local community. Furthermore, TSMC has outlined its strategic vision to expand its footprint by constructing approximately six additional 3D advanced packaging plants in the foreseeable future.