Search
KLA-Tencor (China) Dispatches Its First-Ever Wafer Flatness Measurement Device to an HBM Customer
1 day ago /
Read about 0 minute
Author：小编
Recently, KLA-Tencor (China) has successfully shipped its inaugural wafer flatness measurement device, the GINKGOIFM-P300, to an HBM customer. The introduction of this cutting-edge equipment signifies a monumental leap forward for China in this domain, shattering the prolonged dominance previously held by overseas manufacturers. This device surmounts the measurement constraints encountered by domestic alternatives when dealing with ultra-high warpage wafers and those with low reflectivity. Moreover, it enables comprehensive parameter detection for both bonded wafers and compound semiconductor substrates, including SiC and GaAs.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
