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Tianyue Advanced: Has Launched a Full Range of 12-Inch Substrates
4 day ago /
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Author：小编
On November 20, recent industry news revealed that NVIDIA plans to adopt 12-inch silicon carbide substrates in the advanced packaging stage of its next-generation GPU chips, with an expected introduction by 2027 at the latest. Tianyue Advanced stated on its interactive platform that using 12-inch silicon carbide as an interlayer material can significantly enhance heat dissipation efficiency, increase integration density, reduce packaging size, and lower costs. Currently, the company has launched a full range of 12-inch substrates (semi-insulating, conductive P-type, and conductive N-type).
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