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ACM Research (Shanghai): Delivers First Panel-Level Advanced Packaging Electroplating Equipment
2025-11-17 /
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Author：小编
On November 17, 2025, ACM Research (Shanghai) announced the delivery of its first panel-level advanced packaging electroplating equipment, Ultra ECP ap-p, to a leading panel manufacturing customer. This equipment utilizes ACM's patented horizontal electroplating technology, supporting multi-material electroplating processes including copper, nickel, tin-silver, and gold. It can achieve bump heights exceeding 300 microns with high film thickness uniformity.
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