Search
Intel Unveils Innovative Thermal Management Solution for Large-Scale Advanced Packaging Chips
4 day ago /
Read about 0 minute
Author：小编
Over the years, as CPUs have witnessed enhancements in performance, expanded functionality, and progress in packaging technology, their physical footprint has progressively expanded. Take, for instance, Intel's LGA 1851/1700 platform CPUs, which are equipped with Integrated Heat Spreaders (IHS) boasting significantly larger surface areas than their LGA 1200/1151 platform counterparts. This expansion has, in turn, escalated the complexity involved in the design and installation of Integrated Heat Spreaders. Challenges such as heat buildup and potential warping now pose risks to effective CPU cooling, which could ultimately compromise the CPU's performance.
-
C114 Communication Network -
Communication Home
7 X 24 Track global technological trends
