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Hongrida: Collaborative Venture with Tedoo Technology and Hongke Tongchuang to Launch a Holding Subsidiary for Semiconductor Packaging Lead Frame Operations
3 day ago /
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Author：小编
Hongrida (301285.SZ) has revealed its intention to co-invest 150 million yuan alongside Fujian Tedoo Technology Co., Ltd. and Shanghai Hongke Tongchuang Enterprise Management Partnership (a limited partnership entity) to set up Hongke Semiconductor (Dongtai) Co., Ltd. This new entity will be dedicated to the research, development, design, production, and marketing of semiconductor packaging lead frames. Specifically, Hongrida will inject 90 million yuan into the venture, securing a 60% ownership stake. The primary objective of this strategic investment is to harness the combined resources of all stakeholders, capitalize on emerging market prospects, and cultivate fresh avenues for corporate expansion and growth.
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