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In the fourth quarter of this year, TSMC is poised to embark on mass production utilizing its most cutting-edge 2-nanometer process. Additionally, the company's production capacity for CoWoS advanced packaging is set to experience a consistent and robust expansion. Simultaneously, TSMC's newly established factories in Kumamoto, Japan; Arizona, USA; Kaohsiung; and Baoshan, Hsinchu, are on track to commence mass production as initially planned. At present, TSMC is unwavering in its commitment to bolstering its competitive edge while making steady progress along its development trajectory. Looking forward to 2026, TSMC is set to achieve a momentous milestone: the mass production of silicon photonics CPO (Co-Packaged Optics), marking a significant leap forward in technological innovation.
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