On October 27th, a newly published paper by Professor Peng Hailin's team from the College of Chemistry and Molecular Engineering at Peking University, along with their collaborators, in Nature Communications has garnered significant attention. This research represents the inaugural use of cryo-electron tomography (Cryo-ET) in the semiconductor industry. It unveils the in-situ microscopic three-dimensional structures, interfacial distributions, and entanglement patterns of photoresist molecules within a liquid-phase setting. Leveraging these discoveries, the team has developed an industrial solution that can substantially diminish lithography defects. This innovation has the potential to boost the efficiency of minimizing pattern defects in lithography technology by more than 99%. In an interview, Peng Hailin emphasized that the research outcomes can be seamlessly integrated into semiconductor manufacturing, providing a viable technical approach that is fully compatible with current equipment.