On October 23, 2025, Micron Technology made an announcement stating that it has officially commenced the dispatch of samples of its 192GB SOCAMM2 memory module to customers. This move is aimed at vigorously promoting the application of low-power memory in AI data centers. Micron highlighted that with the rapid advancement of AI innovation, the data center ecosystem is evolving towards a more energy-efficient infrastructure. In this transformation, low-power memory solutions have emerged as the linchpin.

The SOCAMM2 module employs 1-gamma LPDDR5X DRAM technology. When compared to the first generation, it offers a 50% boost in capacity and enhances DRAM Die-level energy efficiency by over 20%. During testing with AI systems in data centers, it has achieved a remarkable reduction of over 80% in the latency for the first Token. Moreover, it can supply over 40TB of CPU memory within the Vera Rubin NVL144 rack system.