UMC has officially launched a state-of-the-art 55-nanometer BCD process platform, which seamlessly integrates three distinct process types: non-epitaxial, epitaxial, and SOI (Silicon On Insulator). This innovative platform boasts a suite of advanced technologies, including UTM (Ultra-Thick Metal) layers for enhanced conductivity, eFLASH embedded flash memory for seamless data storage, and RRAM (Resistive Random Access Memory) memristors for efficient memory operations.

Characterized by its compact footprint, minimal power consumption, and robust noise immunity, this platform is ideally suited for a wide array of applications, spanning smartphones, wearable gadgets, automotive electronics, smart home systems, and industrial automation. By significantly boosting power efficiency and system integration capabilities, it not only solidifies UMC's competitive edge in the market but also expedites the product development cycle for its customers.