SK Hynix has recently introduced its second-generation 3Gb DDR5 'A-Die' memory chip, which goes by the code name 'X021' and bears the part number 'AKBD'. As per the in-depth analysis conducted by Unikos Hardware, the 'X021' designation unmistakably points to it being a second-generation 3Gb A-Die chip. This new chip is poised to take over from the currently prevalent 3Gb M-Die chips in DDR5 memory modules.

In terms of performance, the native JEDEC speed of this cutting-edge chip has the potential to climb as high as 7200MT/s. This impressive speed is well-aligned with Intel's upcoming processor roadmap, suggesting a seamless integration and optimized performance when used in conjunction with future Intel processors.

The memory sample that has been revealed showcases an 8-layer PCB design. However, it's not all smooth sailing. Under high-speed signal conditions, this design encounters hurdles in terms of stability and power supply capabilities, indicating that further refinements might be necessary to fully harness its potential.