On an interactive platform, HGTECH announced that the company is endowed with complete in - house research and development (R&D) and design capabilities, spanning the entire spectrum from silicon photonics chips to modules. The company has made a significant breakthrough by successfully introducing the industry's most advanced 1.6T optical module. This cutting - edge module is powered by a self - developed 200G single - wave silicon photonics chip, and the company also offers a diverse range of 1.6T optical module products, including solutions based on Digital Signal Processing (DSP) and Linear Pluggable Optics (LPO).
In terms of technical infrastructure, the company is well - equipped with a full - fledged silicon photonics material Process Design Kit (PDK). Its self - developed silicon photonics chips have not only secured production capacity at overseas foundries (Fabs) but are also undergoing a rapid production ramp - up. Simultaneously, the company is expanding its capacity at a second overseas backup foundry. Back home, domestic foundries are stepping up their validation processes to ensure seamless integration and high - quality production.
Moreover, as part of its strategic vision to strengthen its position in the upstream sector of the industrial chain, the company has embarked on the establishment of Yunling Optoelectronics. This new entity will serve as an upstream optical chip manufacturer, further solidifying HGTECH's foothold in the industry.