Today, Longsys proudly announced the introduction of the industry's pioneering integrated packaged mSSD (short for 'Micro SSD'). Leveraging the innovative 'Office as Factory' business model, this cutting-edge product has successfully undergone development and rigorous testing phases. It has secured pertinent technical patents both domestically and internationally and is now poised for a ramp-up in mass production.

The mSSD seamlessly integrates a controller chip, memory chip, passive components, and integrated circuits into a singular package through a specialized packaging process. This integration ensures robust electrical connections, physical safeguarding, and efficient thermal management. By adopting Wafer-level System-in-Package (SiP) technology, the mSSD eliminates the need for multiple Surface Mount Technology (SMT) processes, such as PCB placement and reflow soldering. This streamlines production, cuts costs, and enables one-time packaging from Wafer to the final product.

As a result, delivery efficiency has soared by over 100%, while additional costs have plummeted by more than 10%. The mSSD's compact dimensions measure 20×30×2.0mm, and it weighs a mere 2.2g. In terms of performance, it adheres to the PCIe Gen4×4 interface standard, delivering a staggering maximum sequential read speed of up to 7400MB/s and a write speed of up to 6500MB/s. Additionally, it boasts a remarkable maximum 4K random read speed of up to 1000K Input/Output Operations Per Second (IOPS) and a 4K random write speed of up to 820K IOPS.

The product offers a versatile range of capacity options, spanning from 512GB to an impressive 4TB. It comes equipped with a snap-on heat dissipation expansion card, facilitating flexible expansion to various specifications, including M.2 2280, M.2 2242, and M.2 2230. This makes it an ideal choice for a wide array of applications, including PC laptops, gaming handhelds for capacity enhancement, drones, VR devices, and other demanding scenarios.