According to a report from the South Korean media outlet Etnews, Tesla and Apple are currently in the process of evaluating the potential adoption of glass substrates to elevate chip performance. Glass substrates boast a range of benefits, including exceptional flatness, a low coefficient of thermal expansion, robust mechanical strength, and resistance to heat. These attributes can effectively minimize warping and deformation during chip packaging, enhance circuit density, and accelerate data processing speeds. They are especially well - suited for AI chips and data centers.

Major industry players such as Intel, AMD, and Samsung have already proactively ventured into the realm of glass substrates. It is anticipated that this move will spur a more than 30% surge in chip computing speed. Tesla has set its sights on utilizing glass substrates in autonomous driving systems and robotics. Meanwhile, Apple is planning a redesign of its A - series chips and aims to deploy them in data center servers.

In the wake of these developments, Taiwanese companies like Unimicron Technology and Nanya Printed Circuit Board are also ramping up their strategic deployments in the glass substrate sector. Although the manufacturing process of glass substrates is highly challenging and costly, upstream manufacturers such as Absolics are actively gearing up for mass production. Looking ahead, glass substrates are poised to emerge as a crucial option for high - end chip packaging, holding immense market potential.