The Institute of Microstructure Physics, operating under the auspices of the Russian Academy of Sciences, has rolled out a comprehensive long-term development strategy for indigenous extreme ultraviolet (EUV) lithography machinery. This cutting-edge equipment is designed to function at a precise wavelength of 11.2 nanometers, with the project slated to kick off in 2026. At the outset, it will leverage 40-nanometer manufacturing capabilities, with ambitious plans to attain sub-10-nanometer process technology by the year 2037.

This innovative proposal diverges from ASML's existing framework, opting instead for a novel configuration that integrates a hybrid solid-state laser, a xenon plasma light source, and ruthenium-beryllium mirrors. This setup is aimed at minimizing equipment upkeep demands and sidestepping the intricate steps involved in advanced manufacturing processes.

The development roadmap is systematically segmented into three distinct phases, with the equipment's resolution capabilities spanning from 65 nanometers down to a remarkable 9 nanometers. Notably, the projected unit cost is anticipated to undercut that of ASML's established platform.

However, it's important to note that the research and development team has yet to tackle the intricacies associated with the 11.2-nanometer wavelength laser, casting some uncertainty over the plan's feasibility. This suite of equipment is primarily tailored to cater to the requirements of small-scale wafer foundries. Should the implementation prove successful, it holds the promise of facilitating cost-effective chip manufacturing and bolstering export capabilities.