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Huada Beidou Unveils New Short Message Communication Chip and Precise Positioning Service, Expediting the Integration of the Beidou Application Ecosystem
1 week ago /
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Author：小编
On September 24, 2025, the Fourth International Summit on the Large-Scale Application of the Beidou System convened in Zhuzhou, Hunan Province. At this significant event, Shenzhen Huada Beidou Technology Co., Ltd. made an official announcement, introducing its latest-generation Beidou-3 short message communication SoC chip, the HD6180. Leveraging a cutting-edge 22-nanometer manufacturing process, this chip seamlessly integrates baseband and RF (Radio Frequency) functionalities. It boasts a comprehensive enhancement in performance, power efficiency, and integration density, perfectly catering to the application requirements of mobile phones, wearable gadgets, and a host of other devices.
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