Recently, TSMC announced the latest progress of its next-generation A14 (1.4nm) process, stating that the development is proceeding smoothly and the yield is exceeding expectations. This process is expected to enter production in 2028, adopting second-generation GAA nanosheet transistors and the NanoFlex Pro architecture. Compared to the N2 process, it offers a 15% performance improvement, a 30% reduction in power consumption, a 23% increase in logic transistor density, and a 20% increase in chip density. An upgraded version with backside power delivery will be introduced in 2029.