Changdian Technology's Patent for 'Packaging Structure and Packaging Method' Published - Chip

7 x 24 Track global technological trends

Hot Topic

Day

News Topic

Changdian Technology's Patent for 'Packaging Structure and Packaging Method' Published

3 day ago / Read about 0 minute

Author：小编

According to Tianyancha, on March 21, 2025, Jiangsu Changdian Technology Co., Ltd. published a patent named 'Packaging Structure and Packaging Method', with the application publication number CN119673934A.

Previous page：TP-Link's Chip Unit Reportedly Shut Down, with Emp...

Next page：Southbound Funds See Net Inflows for 18 Straight W...

Return to List

Hot Reading

2 day ago

TechCrunch Mobility: The two robotaxi battlegrounds that matter

1 day ago

Earthmover wants to become the Snowflake of weather and geospatial data

1 day ago

Forget AR glasses, VR headsets just got a massive tech boost to keep them relevant

1 day ago

A history of the Internet, part 3: The rise of the user

2 day ago

3 best PlayStation games that need PS5 Pro remasters

1 day ago

iPhone Fold Will Reportedly Look Like Two iPhone Airs Combined Together

1 day ago

I'm a retro gaming expert – here are the 3 best handhelds I currently own, for every budget

2 day ago

This major Switch 2 DLC just surprised me in quite a new way

1 day ago

Nothing's mystery new product revealed – and it's something that'll keep fans very happy

1 day ago

This iPhone 17 rig unlocks pro-level filmmaking without hauling extra gear

Previous page：TP-Link's Chip Unit Reportedly Shut Down, with Emp...

Next page：Southbound Funds See Net Inflows for 18 Straight W...

C114 Communication Network
Communication Home

7 X 24 Track global technological trends

Find

News Topic

Hot Topic

7 x 24 Track global technological trends

News Flash

News Topic

AI
/
Devices
/
Smart Car
/
Chip
/
Cloud

C114 Communication Network

Communication Home