On September 19, SRUI Advanced Materials revealed during an investor conference that its mainstay products for optical modules consist of chip substrates and housings. Given the substantial surge in heat dissipation demands for optical module chips operating at speeds exceeding 400G, there arises a necessity for novel materials that exhibit both low expansion and high thermal conductivity attributes. Tungsten-copper alloys, with varying compositions, are adept at fulfilling the heat dissipation requirements of 400G, 800G, and 1.6T optical modules. Presently, the company's roster of key clients encompasses industry leaders such as Finisar, Global MediaTek, TFC Communication, Solarspectrum, and Dongguan Xuntao, among others.

In response to the escalating heat dissipation demands of optical modules, the company has ingeniously incorporated a cutting-edge copper alloy into the housings of optical modules, thereby surmounting technical hurdles prevalent in the industry. Furthermore, the company is poised to allocate its proprietary funds towards the investment and establishment of a production line with an annual capacity to manufacture 20 million optical module substrates and 10 million optical module housings.