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Huawei Unveils Two Silicon Carbide Heat Dissipation Technologies
3 day ago /
Read about 0 minute
Author：小编
Recently, Huawei has announced two patents, both utilizing silicon carbide as a filler to enhance the thermal conductivity of electronic devices. The two patents are titled 'Thermal Conductive Composition, Its Preparation Method, and Application' and 'A Thermal Conductive and Wave-Absorbing Composition and Its Application', respectively.
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