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South Korean Equipment Giant Hanmi Semiconductor Set to Launch Hybrid Bonding Machines in 2027
3 day ago /
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Author：小编
Hanmi Semiconductor has officially declared that it will commence the sales of its cutting-edge hybrid bonding machines in 2027. These innovative machines are engineered to be more compact and slimmer compared to conventional bonding equipment, thereby significantly minimizing signal loss during operations. Impressively, the company achieved a major milestone by successfully producing its inaugural batch of hybrid bonding machines as far back as 2020. With the anticipated surge in market demand, Hanmi Semiconductor is poised to secure a formidable competitive edge in the industry.
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