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Hanmi Semiconductor: Hybrid Bonding Machine for HBM to Be Launched in 2027
2 day ago /
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Author：小编
South Korean semiconductor equipment company Hanmi Semiconductor announced that its hybrid bonding machine for high-bandwidth memory (HBM) is expected to be launched in 2027, and its hybrid bonding machine for system on a chip (SoC) is expected to be launched in 2028.
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