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On September 18, 2025, during the Huawei Connect 2025 event, Xu Zhijun, the Rotating Chairman of Huawei, took the stage to disclose, for the very first time, the development blueprint and objectives for the Ascend chip series over the forthcoming three years. He mentioned that Huawei has a comprehensive lineup of Ascend chips in the pipeline, encompassing the 950PR, 950DT, 960, and 970 models.
Specifically, the 950PR chip is slated for a market debut in the first quarter of 2026, and it will incorporate Huawei's proprietary HBM technology. Furthermore, the 950DT chip is projected to hit the shelves in the fourth quarter of 2026. Meanwhile, the 960 and 970 chips are expected to make their appearances in the fourth quarters of 2027 and 2028, respectively.
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