On September 18, during Huawei Connect 2025, Xu Zhijun, the Rotating Chairman of Huawei, took the stage to, for the first time, disclose the development blueprint for Ascend chips over the upcoming three years. He mentioned that Huawei has a well-laid-out plan for a series of Ascend chips, encompassing the 950PR, 950DT, 960, and 970 models. Notably, the Ascend 950PR is slated to make its grand entrance in the first quarter of 2026, and it will boast Huawei's independently developed HBM technology.