Tencent's Tang Daosheng Addresses Full - Scale Integration with Mainstream Domestic Chips: Committed to Ongoing Multi - Vendor Collaboration
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Author:小编   

On September 16, 2025, during the 2025 Tencent Global Digital Ecosystem Summit, Tang Daosheng, who serves as the Senior Executive Vice President of Tencent Group and the CEO of the Cloud and Smart Industries Group, made it clear that Tencent is actively engaging in collaboration and adaptation efforts with a range of chip vendors. In the tech world, different application scenarios demand a diverse array of models, each with its own unique chip configuration requirements. Taking this into account, Tencent intends to persist in its collaborative endeavors. The company will concentrate on the software domain, carefully choosing the most suitable hardware for various scenarios. On the morning of that very day, Tencent Cloud made a significant announcement. It revealed that it has achieved full - scale adaptation to mainstream domestic chips. Moreover, Tencent Cloud is not just a passive participant; it is actively involved in and making valuable contributions to the open - source community. Tencent Cloud has a well - defined long - term strategy. This strategy centers around full - stack optimization achieved through the synergy of hardware and software. By harnessing software capabilities on heterogeneous computing platforms, Tencent Cloud aims to seamlessly integrate different types of chip resources. Ultimately, the goal is to offer cost - effective AI computing power to external users.