On September 16, during the 2025 Tencent Global Digital Ecosystem Summit, Tang Daosheng, who serves as the Senior Executive Vice President of Tencent Group and also holds the position of CEO of the Cloud and Smart Industries Group, disclosed that Tencent has embarked on collaborative and adaptive endeavors with a multitude of chip manufacturers.

He elaborated that the realm of AI models is incredibly diverse, with model sizes spanning from several billion (B) parameters all the way up to over a trillion parameters. Given this wide range, different application scenarios necessitate chips with distinct configurations. Tencent is committed to maintaining an open - minded approach and will forge partnerships with a variety of chip manufacturers. In some cases, these collaborations will even involve customized adaptation to meet specific needs.

In the meantime, Qiu Yuepeng, the Vice President of Tencent Group and President of Tencent Cloud, made an announcement. He stated that Tencent has achieved full compatibility with mainstream domestic chips. Moreover, through the utilization of a heterogeneous computing platform, Tencent has successfully integrated multiple types of chips. This integration enables the provision of cost - effective AI computing power solutions.