According to sources within the supply chain, Apple's forthcoming A20 chip will incorporate TSMC's cutting-edge 2nm process technology, complemented by WMCM advanced packaging technology. In parallel, the M6 chip designed for MacBooks and the R2 chip for Vision Pro headsets are also anticipated to harness this advanced process. TSMC is diligently scaling up its relevant production capabilities, aiming for a 2nm capacity of 40,000 wafers by the year's end, with projections to escalate to 100,000 wafers in the following year. The WMCM packaging technology signifies an enhancement over the current InFO packaging production line, with a projected capacity ranging from 70,000 to 80,000 wafers by the conclusion of 2026. Experts in the semiconductor industry note that TSMC holds a high degree of confidence in the 2nm process, which will introduce GAA (Gate-All-Around) technology while preserving the same number of EUV (Extreme Ultraviolet) layers as the 3nm chip. This approach offers a more cost-efficient production edge, thereby garnering greater favor among customers.