On September 16, 2025, MediaTek made an official announcement on its website, revealing that its inaugural flagship system - on - a - chip (SoC), which leverages TSMC's cutting - edge 2 - nanometer process, has successfully completed the design tape - out phase. Mass production and subsequent market introduction are anticipated by the close of 2026. Although the exact product name remains under wraps, industry insiders, drawing on MediaTek's product roadmap, speculate that this chip will probably be the next - generation Dimensity 9 series flagship, tentatively named the Dimensity 9600. TSMC's 2 - nanometer process technology represents a significant leap forward. It incorporates a nanosheet transistor structure for the very first time. When compared to the existing N3E process, this innovative structure brings about a 1.2 - fold increase in logic density. Moreover, at the same power consumption level, it can deliver performance enhancements of up to 18%. Alternatively, when operating at the same frequency, it can reduce power consumption by approximately 36%.