Given that the power consumption of AI's brand - new Rubin platform, along with the upcoming next - generation Feynman platform, could potentially surpass 2000W, the existing thermal solutions are simply not up to the task. Nvidia has reportedly put in a request to its suppliers, asking them to develop 'Microchannel Liquid Cold Plate (MLCP)' technology. This new technology comes with a price tag that's 3 to 5 times higher than that of the currently available solutions.
