SK Hynix has recently made a significant announcement, revealing the successful development and readiness for mass production of the world's inaugural HBM4 memory. This breakthrough achievement attains the pinnacle of global standards in terms of data processing speed and energy efficiency. Once integrated into customer systems, it is projected that AI service performance could experience an enhancement of up to 69%. In comparison to its predecessor, the HBM3E, the HBM4 boasts a doubling of data transmission channels to 2048, a doubling of bandwidth, and operates at speeds surpassing 10Gbps. Moreover, it achieves a 40% improvement in energy efficiency. This remarkable product leverages SK Hynix's proprietary MR-MUF packaging technology and fifth-generation 10-nanometer-class DRAM process, thereby establishing the world's first mass production system. In the wake of this news, SK Hynix's stock price witnessed a surge of over 5% during trading hours. At present, the high-end HBM market is primarily dominated by Samsung, Micron, and Hynix. Despite Samsung's plans to commence mass production of HBM4 in 2026, it finds itself at least three months behind schedule. Consequently, it will face considerable challenges in overtaking SK Hynix's leading position in the near term.