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Explosive Demand for AI from NVIDIA and Others Forces TSMC to Advance Production Plans for Advanced Packaging
3 day ago /
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Author：小编
Due to the rapid development of companies like NVIDIA in the AI chip sector, there has been a significant increase in demand for TSMC's advanced packaging services, forcing the company to plan production several months ahead of schedule. As a major supplier of advanced packaging technologies such as CoWoS, TSMC, despite its dominant market position, still finds it challenging to meet all customer demands alone.
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