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Several years back, Intel's newly appointed CEO, Pat Gelsinger, unveiled the ambitious IDM 2.0 strategy. Under this plan, Intel intended to invest over USD 100 billion (equivalent to more than RMB 700 billion) in constructing cutting-edge process wafer fabrication plants across the United States, Europe, Israel, and other regions. The overarching goal was to reclaim Intel's dominant position in the semiconductor industry.
This comprehensive strategy outlined a four-year development roadmap spanning five generations of processes. It was designed not only to bolster Intel's in-house production and sales of CPUs, GPUs, and AI chips but also to position Intel as a formidable competitor against TSMC and Samsung in the highly competitive wafer foundry market.
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