Based on information sourced from Tianyancha, the patent application for the "Heating Component of Heat Treatment Equipment" submitted by Beijing Yitang Semiconductor Technology Co., Ltd. has now been made public. The application was officially published on March 21, 2025, and is assigned the publication number CN119673811A. This particular patent is designed to improve the flexibility in adjusting thermal power and enhance temperature consistency throughout the heat treatment process, aligning with common practices in the English - speaking patent - writing context where clear and precise objectives are stated.
