On September 6, news emerged that on September 4, the Chairman Forum on Semiconductor Manufacturing, Equipment, and Core Components was held as part of the 13th Semiconductor Equipment, Core Components, and Materials Expo (CSEAC 2025) in Wuxi. This forum was co-organized by the China Electronic Special Equipment Industry Association and Shanghai Securities News · China Securities Network.

In his address, Li Weiming, CTO and Vice Chairman of Weidao Nano, highlighted that within the next three to five years, the number of transistors on a single chip is projected to soar to one trillion, while the global semiconductor market is anticipated to surpass one trillion US dollars in value. He underscored that these two "one trillion" milestones underscore the immense potential of the semiconductor sector, paving the way for novel opportunities in advanced materials, cutting-edge processes, and innovative equipment.

Li Weiming asserted that equipment and materials form the bedrock of wafer fabrication facilities (fabs), and equipment manufacturers must proactively innovate ahead of wafer fabs rather than merely following in their wake. Moreover, he pointed out that domestic equipment manufacturers boast superior service capabilities in customer support, customized processes, and equipment provision, thereby offering more robust backing for the growth of local wafer fabs.