Moore Threads and Intermediary Institutions Reply to the First Round of Review and Inquiry Letter - Chip

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Moore Threads and Intermediary Institutions Reply to the First Round of Review and Inquiry Letter

2025-09-05 / Read about 0 minute

Author：小编

The Shanghai Stock Exchange issued the 'Review and Inquiry Letter Regarding the Application Documents for the Initial Public Offering and Listing on the Science and Technology Innovation Board by Moore Threads Intelligent Technology (Beijing) Co., Ltd.' on July 17, 2025. Moore Threads, along with its sponsor CITIC Securities, Jingtian & Gongcheng Law Firm, and Ernst & Young Accounting Firm, have thoroughly studied and addressed each question in the inquiry letter. We now submit our replies for review.

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