AMD's upcoming Ryzen processors, which will embody the next-generation Zen 6 architecture, will adopt TSMC's state-of-the-art process technology. Specifically, the Compute Chiplet (CCD) will harness the N2P 2nm process, while the Input/Output Die (IOD) will employ the N3P 3nm process. According to renowned industry insider Kepler_L2, this technological leap will bring about substantial performance boosts and enhanced energy efficiency compared to the current Zen 5 architecture, which relies on 4nm and 6nm processes. TSMC's N2P 2nm process is anticipated to commence mass production in the third quarter of 2026, pointing towards a potential market release of Zen 6-based Ryzen processors by the end of the same year.