Groundbreaking Innovation: Chinese Scientists Create World's First Smart Chip for Full-Band High-Speed Communication
2025-08-28 / Read about 0 minute
Author:小编   

On August 28, Chinese researchers leveraged cutting-edge lithium niobate thin-film photonic materials to unveil the world's pioneering adaptive full-band high-speed wireless communication chip, leveraging optoelectronic fusion integration technology. This remarkable feat was published in the esteemed journal Nature on August 27. Experimental results demonstrate that the chip system boasts a wireless transmission rate exceeding 120Gbps, effortlessly meeting the peak rate demands of 6G communication. Notably, it maintains stable performance across the entire bandwidth without any degradation in high-frequency bands. This groundbreaking development offers a promising solution for the efficient utilization of spectrum resources in high-frequency bands, such as terahertz, for the advancement of 6G communication.