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SK Hynix Introduces High-Thermal Efficiency Mobile DRAM to Address Smartphone Overheating Issues
2025-08-28 /
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Author：小编
SK Hynix announced on Thursday the launch of a mobile DRAM product featuring enhanced thermal efficiency, designed to tackle the rising power consumption challenges faced by AI-enabled devices. This innovative product employs an epoxy molding compound to safeguard the chip against damage from water, heat, and impact. By improving performance, these mobile DRAM chips enable smartphones to reduce power consumption, ultimately enhancing battery life and overall product durability.
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