At the Hot Chips 2025 conference, the Japanese semiconductor company Rapidus announced a significant milestone: the successful tape-out of 2nm GAA test chips. The company plans to commence mass production at its IIM-1 fabrication facility in 2027. These advanced chips leverage ASML's cutting-edge extreme ultraviolet lithography technology and have met all predefined electrical performance standards. Additionally, Rapidus showcased the development objectives for the IIM-1 fab, highlighting its competitive edge over industry giants like TSMC and appealing to potential clients such as Intel. By emphasizing production flexibility and promising swift wafer delivery at the 2nm node, Rapidus aims to distinguish itself in the market.