Shiyun Circuit or its holding subsidiaries intend to allocate 1.5 billion yuan towards the development of the 'Core Innovation Smart Carrier' project, aimed at establishing a new generation of PCB smart manufacturing base. This initiative is projected to commence in the latter half of 2025, with production slated to begin in mid-2026. The primary focus of this project is the production of embedded chip PCBs and high-order HDI circuit boards, with an annual design capacity of 660,000 square meters.