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SK Hynix Commences Mass Production of 321-Layer QLC NAND Flash Memory, Aiming for AI Data Center Market Entry Next Year
2025-08-25 /
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Author：小编
On August 25, SK Hynix proudly announced the successful development and commencement of mass production of a groundbreaking 321-layer 2Tb QLC NAND flash memory product. The company anticipates that this product will officially debut in the AI data center market during the first half of next year. Initially, SK Hynix intends to deploy this flash memory in PC SSDs, gradually expanding its application to enterprise-level eSSDs and smartphone embedded storage (UFS) products. Furthermore, the company will employ advanced packaging technology, stacking 32 NAND chips to double integration, thereby officially entering the high-stakes AI server ultra-high-capacity eSSD market.
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