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Publication of CoreLink's Patent on "WAT Test Structure and Method"
2025-08-21 /
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Author：小编
On March 18, 2025, CoreLink Integrated Circuit Manufacturing Co., Ltd. officially published its invention patent titled "WAT Test Structure and WAT Test Method," bearing the publication number CN119650549A. This patent introduces a novel test structure that significantly enhances the accuracy and efficiency of WAT (Wafer Acceptance Test) for integrated circuits.
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